TOOLS FOR DIE ONDING PROCESS

Company Profile

Company Name DIATEC CORPORATION
Representative Hiroaki Ikeda
Established Oct. 10, 1977
Location HQ & Plant Soka City, Saitama, Japan
Employee 35
Capital JPY41million (USD482k)
HP https://www.diatec.jp/index.html

Business Outline

What is Pick Up Tool…?

Back End Process of Semiconductor

TOOL for DIE BONDING Process

What Types …?

Die Collets
Pick Up Tools

Applications…

Die Collet Pick Up Tool
Application
  • Eutectic die bonding
  • Support - High positioning
  • Minimal contact between Die and Tool
  • Complicated for use
  • Thermo - compression or Epoxy Die Attach
  • Easy to use
  • Full surface contact
  • Less positioning accuracy
  • Chipping prevention is essential
Tools Materials
  • Tungsten Carbide
  • Stainless Steel
  • Combination - 2 parts
  • Metal - Tungsten Carbide, Stainless Steel
  • Plastic - Vespel, Torlon, high temp. Delrin
  • Ceramic - TA, Zr, Al other.

 Black - Advantage  /   Red - Disadvantage

Customer Special Products

Flexible Design Capability

Various design

High temp. for special die and special application

Pick Up Tools Design Consideration

Need to check below 5 items:

  1. Die Dimensions
  2. Material Selection (required heat resistance)
  3. Tip dimension
  4. Vacuum Hole diameter
  5. Machine Considerations

Other Tool

Wire Guide

  • User: Power device
  • Application: Large diameter Copper wire and Aluminum wire
  • Applicable equipment: Cho-Ompa, ORTHODYNE and other
  • Material: Tungsten Carbide, Ceramic

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